Non-contact laser carving process and the equipment
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United States of America Patent
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Issued Date -
Oct 30, 2008
app pub date -
Apr 30, 2007
filing date -
Apr 30, 2007
priority date (Note) -
Abandoned
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Abstract
A non-contact laser carving process and the equipment. By the orientation of an orienting module, the center of a wafer can be amended and oriented to the orienting module precisely. By the rotation of the orienting module and an optical sensor of a transmission mechanical module, the center of the wafer can be obtained precisely. By the compensation of the optical sensor, a specific boundary position is oriented. No matter what the external diameter of the wafer is, the specific boundary position in the wafer can be carved by laser precisely through the transmission mechanical module cooperated with a laser-carving unit, and a specific number can be carved at the specific boundary position of each wafer. Therefore, the wafer can be efficiently traced and controlled, and the amount of the wafer can be figured out easily to raise the quality of the wafer.
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