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Abstract

A one step process for fabricating planar optical waveguides comprises using a laser to cut at least two channels in a substantially planar surface of a piece of dielectric material defining a waveguide there between. The shape and size of the resulting guide can be adjusting by selecting an appropriate combination of laser beam spatial profile, of its power and of the exposure time. A combination of heating and writing lasers can also be used to fabricate waveguides in a dielectric substrate, wherein the heating laser heats the substrate with a relatively broad focused spot, the power of the heating laser being controlled to raise the temperature heating the substrate just below the substrate's threshold temperature at which it begins to absorb electro-magnetic radiation, the writing laser, which yields a spot size smaller than the heating laser then melts the substrate within the focal spot of the heating laser. Compare to processes from the prior art, a waveguide fabrication process according to the present invention results in lower cost, faster processing time and applicability to a wider range of materials. The present process is particularly suited for the mass production of inexpensive photonic devices.

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First Claim