METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ONTO A MICROELECTRONIC WORKPIECE
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United States of America Patent
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Issued Date -
Oct 30, 2008
app pub date -
Apr 25, 2007
filing date -
Apr 25, 2007
priority date (Note) -
Abandoned
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Abstract
Metal seed layers and/or barrier layers are treated to render them more suitable for subsequent electrochemical deposition of metals thereon. The processes employ thermal techniques to reduce metal oxides that have formed on the surface of the seed layers and/or barrier layers.
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