PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Oct 30, 2008
app pub date -
Aug 29, 2007
filing date -
Apr 25, 2007
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Abandoned
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Abstract
An exemplary method for manufacturing a printed circuit board is provided. In the method, firstly, a circuit substrate having a substrate and a number of soldering pads is provided. Secondly, a protective layer is formed onto the circuit substrate in a manner such that the soldering pads are entirely covered by the protective layer. Fourthly, a laser beam is applied onto portions of the protective layer spatially corresponding to the soldering pads in a manner such that the portions of the protective layer is removed, thereby exposing the soldering pads to an exterior. A printed circuit board having a protective layer with high precision of resolution is also provided.
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