Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components

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United States of America Patent

SERIAL NO

10597374

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.

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Patent Owner(s)

Patent OwnerAddress
ENTHONE INC350 FRONTAGE ROAD WEST HAVEN CT 06516

International Classification(s)

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  • 2005 Application Filing Year
  • C25D Class
  • 241 Applications Filed
  • 94 Patents Issued To-Date
  • 39.01 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2005200620072008200920102011201220132014201520160255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abys, Joseph A Warren, NJ 55 702
Eckert, Hans Ullrich Solingen, DE 2 16
Fan, Chonglun Hillshoro, OR 22 280
Khaselev, Oscar Monmouth Junction, NJ 35 189
Kleinfeld, Marlies Wuppertal, DE 11 77
Walch, Eric Solingen, DE 5 37
Xu, Chen New Providence, NJ 336 1930
Zhang, Yun Warren, NJ 273 1506

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Patent Citation Ranking

  • 2 Citation Count
  • C25D Class
  • 10.43 % this patent is cited more than
  • 17 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges221203417241421401 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 8081 - 9091 - 100100 +0102030405060708090100110120130

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