Substrate test probing equipment having forcing part for test head and force-receiving pattern for probe card and methods of using the same
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United States of America Patent
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Apr 20, 2010
Grant Date -
Oct 16, 2008
app pub date -
Apr 7, 2008
filing date -
Apr 11, 2007
priority date (Note) -
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Abstract
Substrate test probing equipment having a force-receiving pattern for a probe card and a forcing part for a test head, and methods of using the same, in which with the force-receiving pattern for the probe card and the forcing part for the test head, thermal expansion and contraction of the probe card can be suppressed when the semiconductor substrate is being tested at high and low temperatures. To this end, to substrate test probing equipment having a substrate mover, a probe card, and a test head is prepared, in which the test head has a forcing part and the probe card has a force-receiving plate. A semiconductor substrate is placed on the substrate mover to be electrically connected with the probe card. The semiconductor substrate is electrically tested by the probe card and the test head. When the semiconductor substrate is being tested, the forcing part of the test head is brought into contact with the force-receiving pattern of the probe card.
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