Cooling module applied for liquid containers
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United States of America Patent
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Issued Date -
Oct 16, 2008
app pub date -
Jun 26, 2007
filing date -
Apr 12, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A cooling module applied for liquid containers comprises: A cooling pipeline forms with an inlet and an outlet for refrigerant to flow through. The liquid pipeline conducts liquids to flow through a thermal-exchanging matrix. The thermal-exchanging matrix is made from metals such as copper or aluminum. The cooling pipeline and liquid pipeline are both installed inside the thermal-exchanging matrix. The thermal-exchanging matrix is pre-cooled and therefore being kept at a predetermined temperature by the thermal controller. Consequently, through flown in and out of the thermal-exchanging matrix, the liquid is cooled down in short time and therefore kept at the predetermined temperature.
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