High Damping, High Stiffness Multilayer Metal Polymer Sandwich Structure and Method

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United States of America Patent

APP PUB NO 20080248274A1
SERIAL NO

11697400

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An improved multilayer laminate is provided that provides increased flexural stiffness and increased damping. The laminate includes a thick and stiff lightweight core layer; a first and second constraining layer flanking the core layer; a first damping layer in contact with one of the first and the second constraining layers and spanning substantially the entirety of the respective first or second constraining layer with which it is in contact; and wherein the stiff core layer has a thickness at least approximately 10 times the first damping layer. The stiff core layer has a thickness at least approximately 20% of the multilayer laminate. The laminate may include a second damping layer in contact with the other of the first and the second constraining layers. The shear modulus of the stiff core layer is at least approximately a factor of 10 higher than the shear modulus of the first damping layer.

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Patent Owner(s)

Patent OwnerAddress
MATERIAL SCIENCES CORPORATION6855 COMMERCE BLVD CANTON MI 48187

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hierholz, Karl-Heinz Stuttgart, DE 1 5

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