Optical assemblies and their methods of formation
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United States of America Patent
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N/A
Issued Date -
Oct 9, 2008
app pub date -
Mar 27, 2008
filing date -
Mar 27, 2007
priority date (Note) -
Abandoned
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Abstract
Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.
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