ATOMIC LAYER DEPOSITION REACTOR

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United States of America Patent

APP PUB NO 20080241387A1
SERIAL NO

11693588

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Various reactors for growing thin films on a substrate by subjecting the substrate to alternately repeated surface reactions of vapor-phase reactants are disclosed. The reactor according to the present invention includes a reaction chamber, a substrate holder, a showerhead plate, a first reactant source, a remote radical generator, a second reactant source, and an exhaust outlet. The showerhead plate is configured to define a reaction space between the showerhead plate and the substrate holder. The showerhead plate includes a plurality of passages leading into the reaction space. The substrate is disposed within the reaction space. A first non-radical reactant is supplied through the showerhead plate to the reaction space. The remote radical generator produces the radicals of a second reactant supplied from the second reactant source. The radicals are supplied directly to the reaction space without passing through the showerhead plate.

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Patent Owner(s)

Patent OwnerAddress
ASM INTERNATIONAL N VALMERE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Keto, Leif R Kauniainen, FI 2 435

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