AG-BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE
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United States of America Patent
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Issued Date -
Oct 2, 2008
app pub date -
Mar 19, 2008
filing date -
Mar 30, 2007
priority date (Note) -
Abandoned
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Abstract
An Ag-based alloy wire for a semiconductor package is highly reliable and can be fabricated with low costs. The Ag-based alloy wire includes 0.05.about.5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder.
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