METHOD AND APPARATUS FOR SELECTIVE ELECTROFILLING OF THROUGH-WAFER VIAS
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United States of America Patent
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Issued Date -
Oct 2, 2008
app pub date -
Mar 30, 2007
filing date -
Mar 30, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A device for electrodepositing a conductive material from a first solution into at least one feature formed on a wafer includes a hollow body, an electrode, and a moving mechanism. The hollow body includes a first opening and a second opening. The first solution is supplied to the second opening and injected from the first opening. The electrode is disposed within the hollow body. A potential difference is applicable between the first electrode and the surface of the wafer to electrodeposit the conductive material into the at least one feature. The moving mechanism is mechanically coupled to the hollow body. The moving mechanism is configured to position the first opening of the hollow body over the at least one feature.
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