SEMICONDUCTOR ETCH RESIDUE REMOVER AND CLEANSING COMPOSITIONS
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United States of America Patent
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Issued Date -
Sep 25, 2008
app pub date -
Mar 21, 2007
filing date -
Mar 21, 2007
priority date (Note) -
Abandoned
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Abstract
An aqueous and semi-aqueous formulation useful for removing post etch and ash residue from Cu low K dielectric semiconductor devices. The composition comprises a polycarboxylic acid buffering system, a fluoride system, water, a water miscible organic solvent for the said aqueous compositions and optionally a chelating agent, a metal corrosion inhibitor and a surfactant.
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