Apparatus for removing a semiconductor workpiece from within a fixture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Sep 25, 2008
app pub date -
Mar 19, 2007
filing date -
Mar 19, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a chucking station apparatus for removing a semiconductor workpiece positioned within a chuck, which includes a retainer member and a support member. The chucking station includes an upper assembly and a lower assembly operably connected to the upper assembly by an actuator assembly. The lower assembly has a receiver that receives the chuck and the workpiece residing between the retainer and support members. When the upper and lower assemblies are in the closed position, a separator element of the lower assembly exerts a force upon an outer periphery of the support member to disengage it from the retainer member. In an open position where the upper and lower assemblies are spaced a distance apart, the support member is disconnected from the retainer member to expose the workpiece. A release assembly of the lower assembly elevates the workpiece to present it for removal from the chucking station. The chucking station can include a vacuum system that provides suction in order to secure the retainer member or the support member to the upper and lower assemblies, respectively.
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