SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY
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United States of America Patent
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Issued Date -
Sep 25, 2008
app pub date -
Mar 19, 2008
filing date -
Mar 23, 2007
priority date (Note) -
Abandoned
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Abstract
A semiconductor package using Ag or Ag alloy wire which can maintain superior reliability against a noble metal and lower its manufacturing cost is provided. The semiconductor package comprises a semiconductor substrate. A semiconductor chip is attached to the package substrate and has one or more pads which comprise a noble metal. And one or more wires are bonded so as to electrically connect the one or more pads and the package substrate and comprise Ag or Ag alloy.
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