Solid memory module structure with extensible capacity

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20080228994A1
SERIAL NO

11800140

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Abstract

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A solid memory module structure with extensible capacity includes at least a non-volatile memory module, each of which has at least a memory chip, a first connector, and a control unit. And A Solid memory module includes at least a second connector, which electrically connects the first connector of the volatile memory module, and a system interfac3. The control unit of the non-volatile memory module obtains external signals by this system interface and then transmits to this non-volatile memory module by the control unit to store or use the memory content.

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Patent Owner(s)

Patent OwnerAddress
ENDICOTT INTERCONNECT TECHNOLOGIES INC1093 CLARK STREET ENDICOTT NY 13760

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Kun Lin Chupei, TW 3 5
Lu, Li Hui Chupei, TW 8 13

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