INTEGRATED ARRANGEMENT AND METHOD FOR PRODUCTION
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United States of America Patent
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Issued Date -
Sep 11, 2008
app pub date -
Dec 26, 2007
filing date -
Dec 23, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated arrangement with a circuit and a MEMS switch element is provided, in which the circuit has a plurality of semiconductor components that are connected to form the circuit by metallic traces in several metallization levels located one over the other, in which the metallization levels are located between the MEMS switch element and the semiconductor components, so that the MEMS switch element is located over the topmost metallization level, in which the MEMS switch element is designed to be movable, the MEMS switch element is positioned with respect to a dielectric, so that the movable MEMS switch element and the dielectric produce a variable impedance (for a high-frequency signal), and in which a drive electrode, which is positioned with respect to the MEMS switch element and is for producing an electrostatic force to move the MEMS switch element, is constructed in the topmost metallization level.
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