Resin filling apparatus, filling method, and method of manufacturing an electronic device
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United States of America Patent
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Jun 7, 2011
Issued Date -
N/A
app pub date -
Jan 25, 2008
filing date -
Mar 5, 2007
priority date (Note) -
Expired
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Abstract
A resin filling apparatus, a filling method, and a method of manufacturing an electronic device fill a cavity between a substrate and an electronic component mounted on the substrate with resin. The resin filling apparatus includes a stage for supporting the substrate in an inclined state, and an application head for filling the cavity with resin from a lower side of the inclined substrate.
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