Apparatus and Method for Separating and Transporting Substrates
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United States of America Patent
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Issued Date -
Sep 4, 2008
app pub date -
Jul 5, 2007
filing date -
Jul 6, 2006
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Abandoned
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Abstract
The invention relates in particular to the separation and transportation of a disc shaped substrate (102; 202) such as e.g. a solar wafer. The invention is characterized by the fact that separations take place within a fluid, and that adhesion forces resulting from a thin fluid film develop between a gripper (108; 208) and the substrate to be separated (102; 202) that enable adherence to the gripper (108; 208). Through unloading perpendicular to the feed direction (105; 205) or particularly in parallel to the planar design of the substrates (102; 202), a very gentle and efficient separation of disc shaped substrates (102; 202) is possible with a short cycle time.
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