SEMICONDUCTOR COMPONENT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 4, 2008
app pub date -
Dec 14, 2007
filing date -
Dec 16, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor component is provided, particularly for LIN bus systems, having an integrated circuit, which on a top side has a plurality of terminal pads for coupling and/or decoupling of electrical signals, and having a plurality of electrically conductive contact reeds, which are electrically connected at least partially by connecting bonding wires to the respectively assigned terminal pads of the integrated circuit. Also, a connecting bonding wire and a shielding bonding wire is provided, which is disposed with both ends on a uniform electric potential, particularly on one of the contact reeds.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully