Electrodeposition Material, Process for Providing a Corrosion-Protective Layer of TiO2 on an Electrically Conductive Substrate and Metal Substrate Coated with a Layer of TiO2
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United States of America Patent
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app pub date -
Dec 20, 2007
filing date -
Jun 22, 2005
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Abstract
The present invention relates to electrodeposition material for the electrochemical deposition of a corrosion-protective layer of TiO.sub.2 on an electrically conductive substrate comprising a titanium compound, a complexing agent, an accelerator, water and optionally organic solvents, buffering agents and one or more additives, characterized in that the titanium compound is titanyl sulfate and/or titanyl oxalate, the complexing agent is selected from the group consisting of citric acid, citrates, tartaric acid, tartrates, lactic acid, lactates, gluconic acid, gluconates, polyhydroxy-polycarbonic acids, ethylenediaminetetraacetate, methylglycinediacetate, iminodisuccinate, nitrilotriacetic acid and nitrilotriacetate, triethanolamine, phosphonic acid and phosphonates, polyaspartic acid and polyaspartates, polyacrylic acid and polyacrylates and the accelerator is selected from the group consisting of H.sub.2O.sub.2 and organic peroxides. The invention further relates to a process for providing a corrosion-protective layer of TiO.sub.2 on an electrically conductive substrate and to a metal substrate coated with a layer of TiO.sub.2.
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