SINGLE WAFER ANNEAL PROCESSOR
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United States of America Patent
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Issued Date -
Aug 28, 2008
app pub date -
Feb 28, 2007
filing date -
Feb 28, 2007
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Abandoned
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Abstract
A thermal processor is adapted for annealing substrates. The processor has a sealed process chamber. Air is excluded from the process chamber during processing to avoid oxidation of substrate surfaces, such as copper surfaces. The substrate temperature is controlled by selectively positioning the substrate between a hot plate and a cold plate operating at steady state conditions. During loading and/or unloading, the air flow is induced over the substrate. This keeps the substrate at a temperature low enough to avoid oxidation, even though the heater may remain on.
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