POLISHING METHOD OF SEMICONDUCTOR SUBSTRATE
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United States of America Patent
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Issued Date -
Aug 21, 2008
app pub date -
Feb 19, 2008
filing date -
Feb 20, 2007
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a method of polishing a semiconductor substrate, comprising pressing a semiconductor substrate having a film to be polished that is held by a carrier onto a polishing cloth fixed on a revolving polishing table and supplying a polishing slurry to the space between the polishing cloth and the semiconductor substrate, wherein the end point of polishing is determined according to the change in the friction coefficient while the friction coefficient between the semiconductor substrate and the polishing cloth is measured. According to the present invention it is possible to measure friction coefficient accurately in polishing a semiconductor substrate and use the change thereof to determine the end point of polishing.
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