Three-dimensional microstructures and methods of formation thereof
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United States of America Patent
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Issued Date -
Aug 21, 2008
app pub date -
Dec 28, 2007
filing date -
Dec 30, 2006
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Abandoned
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Abstract
Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
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