FILLED POLYAMIDE MOLDING MATERIALS SHOWING A REDUCED WATER ABSORPTION
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United States of America Patent
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Issued Date -
Aug 14, 2008
app pub date -
Feb 7, 2008
filing date -
Feb 7, 2007
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Abstract
The present invention relates to filled polyamide molding materials, in particular polyamide molding materials with medium filler content, which are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices. The thermoplastic polyamide molding materials according to the present invention are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
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