MOLD INSPECTING METHOD AND RESIN RESIDUE REMOVING METHOD OF NANOIMPRINT LITHOGRAPHY
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United States of America Patent
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Issued Date -
Aug 14, 2008
app pub date -
Jan 25, 2008
filing date -
Feb 8, 2007
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Abandoned
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Abstract
A residue of a thermosetting resin or a photo-curing resin adhered to a mold is detected by comparing a three-dimensional shape 1 measured by AFM in fabricating the mold or three-dimensional CAD design data of the mold and a three-dimensional shape after transcription measured by AFM. An accuracy of detecting the residue is promoted by observing the residue with high fidelity by a stylus having a high aspect, or correcting a shape of the stylus. The mold is made to be able to be reutilized by removing the extracted residue physically by an AFM stylus or by an electron beam gas assist etching or a focused ion beam gas assist etching.
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