CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL
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United States of America Patent
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app pub date -
Jan 28, 2008
filing date -
Jan 31, 2007
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Abstract
There is disclosed a conductive ball- or pin-mounted semiconductor packaging substrate having a conductive ball or a conductive pin mounted on a conductive land or through-hole of the semiconductor packaging substrate, wherein the conductive ball or the conductive pin is electrically connected with the conductive land or through-hole through a reflow of a conductive bonding material comprising, at least, a low-melting point lead-free SnBi-based solder and a thermosetting adhesive resin exhibiting fluxing effects.
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