Sensor Module Package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Aug 14, 2008
app pub date -
May 10, 2005
filing date -
May 10, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Sensor module package having a housing element (3) with an opening (4) to a sensor cavity (6) for allowing outside air to reach a sensor device (1) positioned in the sensor cavity (6) for sensing a characteristic of the outside air. Sensor electronics (9) are connected to the sensor device (1) for providing an output signal. The sensor device (1) and sensor electronics (9) are positioned on a substrate (2). The sensor cavity (6) is formed by at least a cavity part of the substrate (2), at least a part of the housing element (3) and the opening (4). A cover member (11) is provided with a mechanical firming element (13) for mounting the sensor module package (10) in a vehicle.
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