Thermoelectric Cooler Module Structure
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United States of America Patent
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Issued Date -
Aug 14, 2008
app pub date -
Feb 14, 2007
filing date -
Feb 14, 2007
priority date (Note) -
Abandoned
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Abstract
The present invention provides a thermoelectric cooler module structure comprising a first conductive pad, a second conductive pad, and a third conductive pad, wherein a first thermoelectric pellet and a second thermoelectric pellet are formed on said first conductive pad separately to connect said first conductive pad and said second conductive pad, said first conductive pad and said third conductive pad, and an isolation layer formed between said first thermoelectric pellet and said second thermoelectric pellet on said first conductive pad.
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