ELECTRONIC PACKAGE STRUCTURE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
Jul 31, 2008
app pub date -
Mar 12, 2007
filing date -
Jan 31, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Calculated Rating
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US Family Size
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Non-US Coverage
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Abstract
An electronic package structure including a first carrier, at least one first electronic element, and a second electronic element is provided. The first carrier has a first carrying surface and a second carrying surface opposite to each other. The first electronic element is disposed above the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The volume of the second electronic element is larger than that of the first electronic element.
First Claim
Other Claims data not available
Family
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| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| TW | A | TW200832657 | Sep 05, 2007 |
| US | A1 | US20080179722 | Oct 31, 2007 |
International Classification(s)
- 2007 Application Filing Year
- H05K Class
- 2820 Applications Filed
- 1354 Patents Issued To-Date
- 48.02 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 8 Citation Count
- H05K Class
- 1.22 % this patent is cited more than
- 17 Age