METHODS AND APPARATUSES TO PRODUCE INLAYS WITH TRANSPONDERS
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United States of America Patent
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Issued Date -
Jul 31, 2008
app pub date -
Mar 10, 2008
filing date -
Sep 26, 2006
priority date (Note) -
Abandoned
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Abstract
A transponder chip module is recessed into the surface of a substrate, end portions of an antenna wire are held in place on terminal areas of the chip module by a patch which may be transparent to allow laser bonding of the wire to the terminal areas. A cover may be disposed over everything. Conductive glue or a solderable material may be used to connect the wire to the terminal areas. A recess for the chip module, and a channel for the antenna wire may be formed by laser ablation. The substrate may be Teslin.TM., PET/PETE or Polycarbonate. The antenna wire may have a diameter of 60 .mu.m. A synthetic cushion material may be provided beneath the transponder chip module.
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