Direct Applied Monolithic Printed Circuit Technology
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United States of America Patent
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N/A
Issued Date -
Jul 31, 2008
app pub date -
Jan 25, 2007
filing date -
Jan 25, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic circuit board is provided. The electronic circuit board includes a substrate and a conductive adhesive adhered to the substrate in a trace pattern. The conductive adhesive mechanically supports and electrically connects an electronic component.
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