IMPLANTABLE DEVICES AND METHODS OF FORMING THE SAME
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United States of America Patent
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Issued Date -
Jul 24, 2008
app pub date -
Aug 22, 2007
filing date -
Aug 28, 2006
priority date (Note) -
Abandoned
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Abstract
An implantable device and method of forming the same comprises a substrate, an adhesion layer, and a capping layer. The adhesion layer comprises a portion with a predominant proportion of palladium, the portion of the predominant proportion of palladium directly on the substrate. The capping layer comprises a capping layer material, and is on the adhesion layer.
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