PRE-MOLDED LEAD FRAME AND PROCESS FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jul 24, 2008
app pub date -
Jul 6, 2007
filing date -
Jan 24, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A lead frame and a method of manufacturing said lead frame is provided wherein a base material with first and second planar sides is first selectively etched from the first side thereof to a predetermined etching level to create etched areas. The etched areas on the first side of the said base material are then filled with a filling compound and thereafter, the base material is etched from the second side to the etching level to expose the filling compound on the second side.
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