METHOD FOR FORMING A DISPLACEMENT TIN ALLOY PLATED FILM, DISPLACEMENT TIN ALLOY PLATING BATH AND METHOD FOR MAINTAINING A PLATING PERFORMANCE
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United States of America Patent
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Issued Date -
Jul 24, 2008
app pub date -
Jan 4, 2008
filing date -
Jan 22, 2007
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Abandoned
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Abstract
Disclosed herein is a method for forming a displacement tin alloy plated film, on a copper or a copper alloy on a substrate, a tin alloy plated film containing at least one additive metal selected from silver, bismuth, palladium, indium, zinc and antimony, the method including the steps of: forming an under layer on the copper or copper alloy in a low temperature displacement tin alloy plating bath at a temperature of 10 to 50.degree. C.; and forming an upper layer on the under layer in a high temperature tin alloy plating bath at a temperature of 40 to 80.degree. C. to form the displacement tin alloy plated film formed of the under layer and the upper layer.
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