Sound absorbing laminates
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United States of America Patent
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app pub date -
Mar 21, 2008
filing date -
Apr 27, 2005
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Abandoned
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Abstract
A process for forming sound absorbing laminates and the resulting laminate which comprises at least one layer of nonwoven fibers bonded to a substrate by a thermoplastic adhesive. The laminate is formed by placing a layer of bonded nonwoven fibers into contact with a substrate and bonding the layer of nonwoven fibers to the substrate. The improvement comprises: utilizing at least one layer of nonwoven fibers coated with an aqueous emulsion of a vinyl acetate-ethylene (VAE) adhesive and then dried. The VAE adhesive is prepared by aqueous emulsion polymerization, contains crystalline ethylene segments and has: (a) a crystalline melting point (T.sub.m) ranging from 35 to 110.degree. C., preferably 50 to 100.degree. C.; measured at a heat rate of 20.degree. C./minute; and, (b) a tensile storage modulus of at least 1.times.10.sup.4 dynes/cm.sup.2 at 115.degree. C. measured at a test frequency of 6.28 rad/sec.
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