Full density Co-W magnetic sputter targets
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United States of America Patent
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Issued Date -
Jul 17, 2008
app pub date -
Jan 11, 2007
filing date -
Jan 11, 2007
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Abandoned
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Abstract
A sputter target is provided with a first elemental phase of a first material, the first material being either cobalt or tungsten, a first intermetallic phase including the first material and a second material, the second material being either tungsten or cobalt and different from the first material, the first material in a greater atomic percentage than the second material, and a second intermetallic phase including the second material and the first material, the second material in a greater atomic percentage than the first material. The sputter target includes 20-80 at. % cobalt, and has a density greater than 99% of a theoretical maximum density thereof. The sputter target is fabricated by selecting a cobalt powder and a tungsten powder having the same particle size distribution, blending the cobalt powder and the tungsten powder to form a blended powder, canning the blended powder, hot pressing the blended powder to form a solid, and machining the solid to form a sputter target.
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