MEMS structure using carbon dioxide and method of fabrication
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United States of America Patent
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Issued Date -
Jul 17, 2008
app pub date -
Jan 12, 2007
filing date -
Jan 12, 2007
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Abandoned
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Abstract
A MEMS device is encapsulated in a carbon dioxide environment, which effectively insulates the MEMS device against arcing in high voltage applications. The carbon dioxide environment may have a pressure of between about 0.2 atm and about 4 atm. Carbon dioxide is shown to be more effective than other insulating gases such as sulfur hexafluoride in preventing arcing for applications having dimensions on the order of microns.
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