Method and Apparatus For Fabricating Polycrystalline Silicon Film Using Transparent Substrate

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United States of America Patent

SERIAL NO

11908584

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Abstract

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Provided is a method and apparatus for fabricating a polycrystalline silicon film using a transparent substrate. The method includes forming a light absorption layer on a surface of the transparent substrate; and heating the light absorption layer using irradiation of Rapid Thermal Process (RTP) light source, while depositing the polycrystalline silicon film on the light absorption layer.

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Patent Owner(s)

Patent OwnerAddress
POINT ENGINEERING CO LTD89 ASANVALLEY-RO DUNPO-MYEON ASAN-SI CHUNGCHEONGNAM-DO 31409

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Bum Mo Gyeonggi-do, KR 162 241

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