Nanoimprinting composition

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United States of America Patent

APP PUB NO 20080167429A1
SERIAL NO

11819462

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a nanoimprinting composition that has good heat resistance and with which a relief pattern that has been formed is not readily eliminated by heating. A relief pattern can be formed easily and efficiently in this nanoimprinting composition. This is accomplished by a nanoimprinting composition including a polyamic acid (B) and an epoxy resin (C), and also accomplished by a nanoimprinting composition including a polyester-polyamic acid (A1) and an epoxy resin (C).

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Patent Owner(s)

Patent OwnerAddress
CHISSO CORPORATIONOSAKA-SHI OSAKA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Satou, Hiroyuki Ichihara-shi, JP 48 396

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