Silicone based compositions for thermal interface materials
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United States of America Patent
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Issued Date -
Jul 10, 2008
app pub date -
Oct 30, 2007
filing date -
Nov 6, 2006
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Abandoned
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Abstract
A device is provided herein which comprises first (203) and second (207) substrates, and a composition (205) disposed between the first and second substrates. The composition comprises a continuous phase and a disperse phase, wherein said continuous phase comprises a partially crosslinked polyorganosiloxane having a polymer backbone, and wherein the number of monomeric units in the polymer backbone is within the range of about 2,000 to about 15,000.
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