Optical sensor package
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United States of America Patent
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Issued Date -
Jul 3, 2008
app pub date -
Dec 13, 2007
filing date -
Dec 27, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention provides an optical sensor package. The package comprises a circuit board, an image sensor module and a packaging cap. The image sensor module electrically connects to the circuit board; the packaging cap is mounted on the circuit board and integrally packages the image sensor module. Hereby, the new architecture of the invention is not complex and its volume is small. The cost of the package is low, and the invention has the functions of electrostatic discharge and waterproofing; besides, the packaging cap can integrally package the image sensor module and a light-emitting module.
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