Wafer inspection machine and method
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United States of America Patent
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N/A
Issued Date -
Jul 3, 2008
app pub date -
Dec 19, 2007
filing date -
Dec 29, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to wafer inspection machine and method. The wafer inspection machine comprises an inspection stage having a first area for unloading an inspected wafer and loading a new wafer to be inspected, and a second area for inspecting a wafer; a plurality of wafer mounting units installed on the inspection stage to face each other; a rotating plate on which a plurality of the wafer mounting units are installed, making a rotation such that each wafer mounting unit is located on the first and second areas in turn; a robot for unloading the inspected wafer from the wafer mounting unit located on the first area and loading a new wafer to be inspected in the wafer mounting unit located on the first area; and a wafer inverting means for inverting the wafer loaded in the wafer mounting unit located on the second area.
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