Device and method for testing semiconductor element, and manufacturing method thereof

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United States of America Patent

APP PUB NO 20080150561A1
SERIAL NO

12003425

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device and a method for testing a semiconductor element, and manufacturing method thereof are provided. The apparatus includes a substrate and a conductive macromolecular elastic structure. The conductive macromolecular elastic structure is disposed on the substrate and defines a receiving space for receiving a conductive bump of the semiconductor element in order to test the semiconductor element.

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Patent Owner(s)

Patent OwnerAddress
ADVANPACK SOLUTIONS PTE LTDSINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bin, Chichik Abd Razak Singapore, SG 2 32
Jimmy, Chew Hwee-Seng Singapore, SG 5 55
Kian, Ong Chee Singapore, SG 4 50
Zhaohui, Ma Singapore, SG 1 5
Zhiping, Wang Singapore, SG 1 5

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