Compositions for chemical mechanical planarization of copper
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United States of America Patent
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Issued Date -
Jun 26, 2008
app pub date -
Dec 21, 2006
filing date -
Dec 21, 2006
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Abandoned
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Abstract
A composition and associated method for chemical mechanical planarization of a copper-containing substrate are described and which afford low defectivity levels on copper during copper CMP processing. The composition comprises a colloidal silica that is substantially free of soluble polymeric silicates.
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