PLATEN ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING
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United States of America Patent
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Issued Date -
Jun 19, 2008
app pub date -
Dec 17, 2007
filing date -
Dec 19, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A processing pad and platen assembly for processing a substrate is provided. The platen assembly includes a spacer having an upper surface adapted to contact a lower surface of a pad assembly, an upper plate having a recessed area coupled to and disposed below the spacer, and a lower plate coupled to and disposed below the upper plate. The pad assembly includes at least a processing layer having a working surface adapted to process a substrate and an electrode disposed below the working surface of the processing layer. The spacer and the pad assembly have apertures therethrough to provide an electrolyte pathway to the platen assembly for removal of residual materials and other byproducts.
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