Super thin LED package for the backlighting applications and fabrication method
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United States of America Patent
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Issued Date -
Jun 19, 2008
app pub date -
Dec 15, 2006
filing date -
Dec 15, 2006
priority date (Note) -
Abandoned
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Abstract
First and second light emitting diode (LED) arrays, which each includes a corresponding number of LED dies, are disposed on a substrate proximately and substantially parallel to one another. Each pair of substantially paralleled LED dies of the first and second arrays is covered by substantially transparent optical encapsulant. The optical encapsulant is one of covered by a reflective layer for a UV to visible spectral region and shaped for total internal light reflection. The substrate is diced along an axis extending in parallel and between the first and second LED arrays.
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