Photosensitive resin composition for forming organic insulating film and device using the same
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United States of America Patent
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Apr 6, 2010
Grant Date -
Jun 19, 2008
app pub date -
Oct 26, 2007
filing date -
Dec 13, 2006
priority date (Note) -
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Abstract
Disclosed is a photosensitive resin composition. The composition comprises [A] an alkali-soluble resin, [B] a photoactive compound and [C] a solvent. The alkali-soluble resin is a copolymer including at least one structural unit with an aziridine group. The composition exhibits good storage stability, high sensitivity, high UV transmittance, high residual film ratio, improved coating uniformity and excellent pattern-forming properties. Further disclosed is an organic insulating film formed using the composition. The organic insulating film has excellent resistance to solvents and chemicals.
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