Laser Machining Method for Printed Circuit Board
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United States of America Patent
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Issued Date -
Jun 19, 2008
app pub date -
Dec 5, 2007
filing date -
Dec 6, 2006
priority date (Note) -
Abandoned
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Abstract
A printed circuit board manufacturing method by which the manufacturing time can be shortened and the manufacturing cost can be reduced. A printed circuit board has an insulating layer on its surface. Positions (first positions) of the printed circuit board where lands are disposed are irradiated with a CO.sub.2 laser beam (first laser beam) so as to form holes with a depth h from the surface. The printed circuit board is then scanned with an excimer laser beam (second laser beam) through a mask. The beam shape of the excimer laser beam is rectangular. Thus, holes reaching the lands are formed in the positions where the lands are disposed, and grooves for forming lines are formed (second positions). In this case, the holes reaching the lands may be formed by the CO.sub.2 laser beam.
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