CIRCUIT CARRIER BOARD/SOLDER PALLETT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Nov 30, 2007
filing date -
Apr 11, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
|
US Family Size
|
Non-US Coverage
|
Abstract
Provided is a plaque and its method of manufacture, the plaque including a binding material and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of the raw materials, optionally preheating the preform, molding the preform into a plaque of the desired thickness, and then cooling the plaque at an elevated temperature to maintain the flatness of the plaque without the need for sanding or otherwise machining the plaque to the desired size. The plaque can then be formed into the desired solder pallet by cutting the plaque to appropriate dimensions, if necessary, and adding holes and/or clips for use in a soldering process for soldering circuit boards, for example.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| US | A1 | US20060226201 | Apr 10, 2006 |
| US | A1 | US20100038824 | Oct 22, 2009 |
International Classification(s)
- 2007 Application Filing Year
- B29C Class
- 2361 Applications Filed
- 1164 Patents Issued To-Date
- 49.31 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 5 Citation Count
- B29C Class
- 4.64 % this patent is cited more than
- 17 Age